With the availability of higher density memory at the consumer level, G.SKILL memory is pushing the performance boundary to DDR4-3200 on current HEDT platforms with up to 8 modules of 32 GB for a total of 256 GB. As shown in the screenshot below, the Trident Z Royal DDR4-3200 CL16 256 GB (32GBx8) is validated on the latest X299-based ASUS ROG Rampage VI Extreme Encore motherboard and the Intel Core i9-9820X processor. Such extremely high-capacity memory kits are the ideal choice for powerful workstations or for systems running multiple virtual machines.
Breaking the DDR4-4000 Barrier with 32 GB Modules – Trident Z Royal DDR4-4000 CL18 128 GB (32 GB x4)
High capacity 32 GB modules are no slouch when it comes to high frequency, breaking through DDR4-4000 CL18 with 128 GB (32GBx4), as shown with the ASUS ROG Rampage VI Extreme Encore motherboard and Intel Core i9-9820X processor.
Massive High-Speed 128 GB on Dual-Channels – Trident Z Neo DDR4-3600 CL18 128 GB (32 GB x4)
Even without a HEDT system, it’s now possible to reach a total of 128 GB on current 4-DIMM motherboards. Under the AMD-optimized Trident Z Neo series, the following screenshot below shows the Trident Z Neo DDR4-3600 CL18 128 GB (32 GB x4) being stress-tested on the MSI MEG X570 GODLIKE motherboard and the AMD Ryzen 5 3600 processor.
Continuing to Push the Limits of AMD Ryzen 3000 – Trident Z Neo DDR4-3800 CL18 64 GB (32 GB x2)
At the extreme limits of AMD Ryzen 3000 platform, G.SKILL is also releasing a blazing dual-module behemoth kit of 64 GB (32 GB x2) at DDR4-3800 CL18 under the Trident Z Neo series, validated on the MSI MEG X570 GODLIKE motherboard and AMD Ryzen 9 3900X processor, as shown below.
For a list of memory specifications based on the new 32GB modules, please refer to the table below
Availability & XMP 2.0 Support
These ultra-high capacity performance memory specifications will support the latest Intel XMP 2.0 for easy overclocking and will be available via G.SKILL worldwide distribution partners in Q4 2019.